ASM TECHNOLOGY SINGAPORE PTE LTD

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 5245
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 50312
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 19106
 
  
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 859
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 8151
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 551
 
  
 
H02K DYNAMO-ELECTRIC MACHINES 5102
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 454
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0021,993 MOLDING SYSTEM FOR APPLYING A UNIFORM CLAMPING PRESSURE ONTO A SUBSTRATEJul 19, 16Jan 25, 18[B29C]
2017/0283,178 ELECTRONIC DEVICE SEPARATOR FOR A FEEDING APPARATUSApr 04, 16Oct 05, 17[H01L, B65G]
2016/0204,003 METHOD OF FORMING ASPER-SILVER ON A LEAD FRAMEJan 08, 15Jul 14, 16[C23C, C25D, H01L]
2016/0014,315 APPARATUS AND METHOD FOR RECONSTRUCTING A THREE-DIMENSIONAL PROFILE OF A TARGET SURFACEJul 09, 14Jan 14, 16[H04N, G06T]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9889521 Method and system for pull testing of wire bondsDec 02, 14Feb 13, 18[B23K, G01N]
9881891 Method of forming three-dimensional wire loops and wire loops formed using the methodNov 15, 16Jan 30, 18[H01L]
9850074 Electronic device separator for a feeding apparatusApr 04, 16Dec 26, 17[H01L, B65G]
9846193 Semiconductor package testing apparatusMay 13, 15Dec 19, 17[G01R]
9847468 Plated lead frame including doped silver layerJun 20, 16Dec 19, 17[H01L, H05K]
9805956 Lead frame and a method of fabrication thereofJan 23, 13Oct 31, 17[H01L, H05K]
9786562 Method and device for cutting wafersApr 11, 16Oct 10, 17[H01L, B23K]
9689453 Active vibration absorberFeb 06, 14Jun 27, 17[F16F]
9671280 LED testing process and correction methods thereforDec 31, 14Jun 06, 17[G01J, G01N]
9640512 Wire bonding apparatus comprising an oscillator mechanismJul 20, 15May 02, 17[H01L, B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0098,659 PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDINGAbandonedOct 23, 12Apr 25, 13[B05D, H01B]
2012/0132,695 WIRE FEEDING APPARATUS FOR WIRE BONDERSAbandonedNov 30, 10May 31, 12[B23K]
2008/0174,981 PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAMEAbandonedJul 06, 07Jul 24, 08[H01R, H05K]
2008/0073,408 MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUSAbandonedSep 22, 06Mar 27, 08[A47J]
2007/0262,119 WIRE BONDING PROCESS FOR INSULATED WIRESAbandonedMay 04, 07Nov 15, 07[A47J]
2007/0125,831 CAPILLARY FOR A BONDING TOOLAbandonedDec 06, 06Jun 07, 07[A47J]
2006/0011,710 Formation of a wire bond with enhanced pullAbandonedJul 13, 04Jan 19, 06[B23K]
2005/0248,041 Electronic device with high lead densityAbandonedMay 05, 04Nov 10, 05[H01L]
2004/0194,803 Cleaning of an electronic deviceAbandonedApr 04, 03Oct 07, 04[B08B]

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